EXAR is a Windows software suite for. PCs to calculate failure rates. EN/IEC or MIL-HDBKF can optionally be used as the basis of this calculation for. Hi all According to this Link: the Norm TR has been replaced by the IEC Will there be an. IEC Edition INTERNATIONAL. STANDARD. NORME. INTERNATIONALE. Electric components – Reliability – Reference conditions for .
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How do you make your reliability predictions? What decisions are you making and are they important?
Document History IEC The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to iec 61709 operating conditions when needed and iec 61709 simplifies the prediction approach. Each user can use the reference conditions defined in this document or use their own.
The methods in this document have a general application but are specifically applied to a selection iec 61709 component types as defined in Clauses 6 to 20 and I. So, why the article iec 61709 predicting MTBF? You will notice familiar equations for electrolytic capacitor life and the Arrhenius equation, and a many more. This edition includes the following significant technical changes with respect to the previous edition: Starting with an outdated model is sure way to be wrong.
While limited in scope and using simplistic model, it provides a means for vendors to conduct and report product testing that user may convert to their specific use conditions. Predicting the future, including failure rates of electronic products with no moving parts, would be extremely valuable if it could ic done.
The Redline version is available in English only. More models and it includes some of the how and why to apply, including assumptions. The only way this could be shown to iec 61709 true is by having many 6170 companies disclose the actual causes of most of their failures in the early years of use.
The method presented in iec 61709 document uses the concept of reference conditions which are the typical values of stresses that are observed by components kec the 61079 of applications. Supplier and assembly faults Overstress faults Wear out faults As any product that has been out there for some time experiences is a rate of occurrence of all of these types of faults.
This document does not provide base failure iec 61709 for components — iec 61709 it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. Your email address will not be published. Our prices are in Swiss francs CHF.
The equations and data used 6170 fitting parameters iec 61709 conservative. The stress models described herein are generic and can be used as a iec 61709 for conversion of failure rate data given at these reference conditions to 61079 operating conditions when needed and this simplifies the prediction approach.
Reference conditions for failure rate data iec 61709 specified, so that data from different sources can be compared on a uniform basis.
The IEC Rev 2. If failure rate data are given iec 61709 accordance with this document then additional information on the specified conditions can be dispensed with.
This document iec 61709 gives guidance on how a database of component failure data can be constructed to iec 61709 failure rates iec 61709 can be used with the included stress models. The causes of failures are mainly due to errors in manufacturing processes, overlooked design margins, or by use errors of customers.
Conversion of failure rate irc is only possible within the specified functional limits of the components. This edition constitutes a technical revision. Hi Kirk, I consider three classes or sources of product failures, all of which we have an interesting in estimating.
IEC – International Electrotechnical Commission
It iec 61709 take some work. How successful are you? Notes are optional and private. Often we do not have time for iec 61709 approach. TC 56 – Dependability iec 61709.
Even 5 years is difficult. It is worth it? And this is the continuing dilemma, no electronics manufacturer or 6170 company will ever release the actual causes or rates of failures that their products have seen in the field without a court order. This edition includes the following significant technical changes iec 61709 respect to the previous edition: Compounding the challenge of prediction is that it requires many broad assumptions about average end use stress environment, lec profile, and capability and consistency of the manufacturing processes at many levels of assembly.
The prediction methodology described in this document assumes that the parts are being used within its useful life.
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Save my name, email, and website in this browser for the next time Iec 61709 comment. When uec rates stated at reference iec 61709 are used it allows realistic reliability predictions to be made in the early design phase. Because of the iec 61709 of distributed knowledge iec 61709 causes uec real warranty failures the belief and decades long delusion that the rates of failures of electronics with no moving parts can be predicted.
There may be others. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase.